Technology

Semiconductor Tools Large ACM Analysis Shanghai Backlog Surges 88% as AI Demand Accelerates


Chinese language semiconductor tools producer ACM Analysis (Shanghai) Inc. introduced an order backlog exceeding 17.07 billion yuan ($2.43 billion) as of late September, marking an 88.2 % year-over-year surge propelled by accelerating home instrument localization and surging world demand for synthetic intelligence infrastructure.

In a regulatory submitting launched late Sept. 30, the Shanghai-listed know-how big confirmed that its order ebook expanded considerably in comparison with voluntary disclosures throughout the identical interval final yr. The corporate’s complete market capitalization stood above 140 billion yuan ($20 billion) following the shut of buying and selling on Sept. 30.

ACM Analysis Shanghai makes a speciality of important wafer fabrication and superior packaging manufacturing tools, together with moist cleansing programs, electroplating instruments, vertical furnace traces, coater-developer tracks, plasma-enhanced chemical vapor deposition (PECVD) programs, and stress-free sharpening instruments. The corporate has repeatedly broadened its platform technique to provide each front-end wafer fabs and panel-level superior packaging services.

For the primary half of 2026, the tools producer reported income of three.72 billion yuan, representing a 13.87 % year-over-year improve, whereas internet revenue attributable to the guardian firm jumped 42.14 % to 989 million yuan. Full-year income for 2026 is projected to achieve between 8.2 billion yuan and eight.8 billion yuan.

Firm officers attributed the top-line growth to a twin wave of home instrument substitute throughout Chinese language semiconductor fabs and increasing world wafer capability pushed by high-performance computing necessities. Accelerated tools supply, set up, and buyer acceptance testing additional supported income recognition all through the interval.

The online revenue development was moreover supported by honest worth positive aspects and funding earnings from exterior holdings alongside a discount in share-based compensation bills. As world AI computing workloads proceed to drive capital expenditure throughout semiconductor provide chains, the corporate stays positioned to seize additional market share throughout home chipmaking and superior packaging operations.